This grant funds international collaborative projects between the EU and Japan focusing on advanced heterogeneous integration in semiconductors, including 2.5D and 3D packaging and integrated photonics to support AI functionalities. Projects should enable standardized chiplet interfaces fostering a dynamic ecosystem and demonstrate solutions at Technology Readiness Levels 5-7 in laboratory and pilot environments with verification in manufacturing use cases. Proposals must also facilitate knowledge transfer and stakeholder engagement through workshops, publications, and networking events.
Eligible applicants must meet admissibility conditions including proposal page limits and layout, be from eligible countries, and satisfy financial and operational capacity requirements as detailed in the Chips for Europe Initiative Work Programme Appendix 8. Evaluation and award criteria and proces
